Toshiba has announced that with the expansion of its production facility in Yokkaichi, Japan production of new 3D flash memory is nearly possible.
The construction is expected to last close to one year and will provide an increase in the manufacturing capacity of NAND flash lines while also providing capability for more advanced manufacturing processes and early generation 3D chip designs.
The new 3D flash memory is the product of a joint venture between SanDisk and Toshiba that aims to expand on the capabilities of current NAND flash technology.
What Is 3D Flash Memory?
NAND flash memory is the gold standard of inexpensive and fast memory technology. NAND flash is used in everything from Solid State Drives to thumb drives to smart phones. The issue arising from this technology is that with today’s manufacturing techniques further miniaturization becomes increasingly more difficult and expensive.
To solve this problem, researchers have devised a way to begin to “stack” NAND flash chips on top of each other, providing increased speed and functionality while staying within the specific set of size constraint that conform with today’s memory cards and smart devices.
Is Toshiba The New Industry Leader?
The new technology behind 3D NAND flash is nothing new with multiple companies patenting and designing proprietary 3D designs. However, Toshiba has taken the first steps in the industry toward the specific manufacturing needed to produce the first generation of 3D NAND flash.
If Toshiba can refine the design and manufacturing process needed for its 3D flash design, then the company should stand to make significant market gains.